Global Application Fields

Empowering Future Technologies

Perfect quality assurance for Mobile AP, Automotive Semiconductors, and High-Performance Computing chips.

Mobile AP

Mobile AP

Mobile AP: Ultra-fine pitch support for next-gen smartphones.

27µm PitchLPDDR5 Support
Automotive

Automotive

Automotive: High-durability tests for ADAS and autonomous driving.

AEC-Q100-40°C ~ 150°C
HPC / AI

HPC / AI

High Performance Computing: Stable signal integrity for AI and data centers.

HBM3 SupportLow Latency
100%
Quality Guaranteed
VLWST
Localization Success
13.1M
Test Cycles
50,000
Max Pin Count

Infinite Applications

AI

Artificial Intelligence: Powering deep learning and neural network processing.

Smart Devices

Smart Devices: Enabling the next generation of interconnected mobility.

Robot & Drones

Robotics & Drones: Precision testing for autonomous mechanical systems.

Aerospace

Aerospace: High-reliability solutions for extreme environments.

Automotive

Automotive: The core of smart mobility and EV safety.

Market Intelligence

A Monumental Shift in the Global Market

Global Market Size

$347.6M
World Map
In Progress

KOREA

STECO, HLMC

Scaling

TAIWAN

NOVATEK, Kyec, ChipMOS (8 Companies)

Expanding

CHINA

Hua Hong, SMIC

Active

USA

Cirus Logic, Cypress, Skyworks

Leading semiconductor companies worldwide are transitioning from Cantilever to Vertical Probe Cards.

High-Growth Test Market with 10% CAGRHigh-Growth Test Market with 10% CAGR

$2.7B
2026
+10% CAGR
$4.2B
2031

Projected Market Valuation Growth

Key Drivers

Explosive demand for AI & HBM, expansion of Autonomous Driving (Mobility), Aerospace, and Defense.

Target Clients

Global Foundry & Fabless (TSMC, Nvidia, Qualcomm, Apple, AMD).

Strategy

Aiming for direct competition with global leaders, rather than settling for the domestic market.

Market Positioning: Global Quality, Rational Price

Market Positioning Strategy

Tech Level / Quality
Price Competitiveness

Global Top Tier

(FormFactor, MJC)

Pain point: High Cost, Slow Customization.

Domestic Standard Competitors

(국내 일반 경쟁사)

Testonic

Premium Positioning

  • Global Spec Quality
  • 40% Lower Cost Structure
  • Fast Customization

Execution Roadmap: From R&D to Global Expansion

Phase 1(2026)Foundation
  • Establishment of Corporate R&D Center
  • Filing of 8 core patents
  • Prototype verification & advanced SI/PI simulation
Phase 2(2027)Validation
  • Field testing with key clients
  • Securing ISO certification and reliability standards
Phase 3(2028~)Expansion
  • Establishment of mass production system
  • Global distributor network expansion (Taiwan/Singapore)

Network & Target Clients

Partner Universities

  • Sungkyunkwan University
  • Soonchunhyang University
  • Inje University

Target Clients

Samsung
Samsung
Nvidia
Nvidia
TSMC
TSMC
Broadcom
Broadcom
AMD
AMD
Qualcomm
Qualcomm
UMC
UMC
GLOBAL SUPPLY CHAIN TARGET

MOBILITY SEMICONDUCTOR

AI & Autonomous
High Performance Computing
Power Efficiency

AI

AI SEMICONDUCTOR

InfineonNXPR

• Global Partnerships

Safety
Reliability
Scalability

MOBILITY SEMICONDUCTOR

AI & Autonomous

High Performance Computing

Power Efficiency

Medical Technology
MEDICALAI SEMICONDUCTOR
MRI | CT SCAN | ULTRASOUND

• Global Partnerships

Safety
Reliability
Scalability