INNOVATION / Line Up
Vertical MEMS
High Difficulty, High Density
For Semiconductor Testing
Cobra Probe
Existing Mass Production
Mainstream Product
Strait Probe Fine Pitch
양산 주력 제품
Memory MEMS
Nand, Dram, HBM 주력 양산 제품
INNOVATION / A/P & Logic IC (추가)
Direct docking Probe Card
Hybride Probe Card
INNOVATION / HBM & Logic IC
HBM (High Bandwidth Memory)
Proprietary HBM Chip Test Technology
Hybrid Vertical Probe Card
Maximizing efficiency by using two or more types of probes simultaneously
INNOVATION / Fine Pitch & System Semiconductor
Cu Pillar Dimension Roadmap
| Metric | Solder Bump (Ref) | Cu Pillar Generation (Roadmap) | ||||
|---|---|---|---|---|---|---|
| Pitch (um) | 150um | 130um | 100um | 80um | 60um | 40um |
| Diameter (um) | 80 um | 60-70um | 40-50um | 25-30um | 20-25um | 20-25um |
| Height (um) | 80 um | 75 um | 60 um | 50 um | 40 um | 35 um |
Solder Bump / Cu Pillar Array Visualization
30µm Cu Pillar
Precision Copper Pillar Structure
Key Technological Advantages
Fine Pitch미세한 Pitch 구현
Enables high-density packaging by achieving more precise and finer pitches than conventional products.
High Current고사양 Speed와 Current 요구 충족
Meets high-performance speed and current requirements with superior data transmission and current density.
Low Leakage미세 Pitch에서의 정밀 측정 기술
Prevents current leakage in micro pitches through advanced precision inspection and measurement technology.
// LIVE_PROCESS_SIMULATION
Pad
Bump
INNOVATION / Structure & Design
PROBE DEPTH
5mm ±100um
High Durability
Precise Alignment
Thermal Stability
INNOVATION / Global Technology Competitiveness
| Technology | TESTONIC (Korea) | T-Corp (Italy) | M-Corp (Taiwan) | J-Corp (Japan) |
|---|---|---|---|---|
| HBM Chip Bump Test | ||||
| 30x30 Octagonal Pad Test | Core Tech | |||
| Logic IC High Current (1A) |